Gigabyte H252-Z10 Socket SP3 Rack (2U) Schwarz, Stahl

2U 4 Nodes - Rear access, AMD EPYC 7003 series, 4 x LGA 4094 Socket SP3, 32 x DIMM slots, 8 x 1GbE LAN ports (1 x Intel I350-AM2)
Hersteller: GIGA-BYTE
Verfügbarkeit: Nicht lagernd, bestellbar
Artikelnummer: CB93869
Herstellernummer: 6NH252Z10MR-00
€4265,82 inkl. Steuer
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Architecture for Modern Data Centers AMD EPYC 7003 Series Processors – “Milan” GIGABYTE servers and AMD EPYC 7003 Series Processors deliver the highest possible I/O throughput to pave the way for fast communication between CPU and accelerator in HPC and data analytics. Max Memory Speed Even at 2 DPC With GIGABYTE unique solution, maximum memory speed is now supported, even when using 2 DIMMS per channel. GIGABYTE’s server platforms give you the performance edge, with more memory capacity at faster speeds. OCP 3.0 Ready GIGABYTE’s G-,H-,R- series offer servers that feature an onboard OCP 3.0 slot for the next generation of PCIe 4.0 add on cards. Advantages of this new type include: Easier Serviceability: simply slot in / pull out the card without needing to open the server chassis; tool less design Larger Thermal Envelope: more space for heat sink provides an increased power budget for new & emerging capabilities Hardware Security Hardware-level Root of Trust Protection is built in the silicon to ensure systems will not be vulnerable to security attacks or cyber threats. This hardware-level root of trust (ROT) helps isolate the system as the boot process starts to make sure a verified code is used. Optional TPM 2.0 Module For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface (SPI) or low pin count (LPC) interface. CMC for Chassis Management & Multi-Node Monitoring GIGABYTE’s H-Series Servers feature a Chassis Management Controller (CMC) for chassis-level management and node-level monitoring by connecting nodes internally via BMC chips integrated on each node. Resulting in only one mLAN connection required to perform monitoring of all four nodes, and results in less Top-of-Rack (ToR) cabling and switch connections. Multi-Server Management GIGABYTE’s H-Series Servers also feature the ability to create a “ring” connection for monitoring & management of all servers in a rack for greater cost savings and management efficiency. Power Efficiency Automatic Fan Speed Control GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers. Cold Redundancy To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, and results of 10% improvement in efficiency. High Availability Smart Crises Management and Protection (SCMP) SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss. Dual ROM Architecture If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version. Value-added Manag
Architecture for Modern Data Centers AMD EPYC 7003 Series Processors – “Milan” GIGABYTE servers and AMD EPYC 7003 Series Processors deliver the highest possible I/O throughput to pave the way for fast communication between CPU and accelerator in HPC and data analytics. Max Memory Speed Even at 2 DPC With GIGABYTE unique solution, maximum memory speed is now supported, even when using 2 DIMMS per channel. GIGABYTE’s server platforms give you the performance edge, with more memory capacity at faster speeds. OCP 3.0 Ready GIGABYTE’s G-,H-,R- series offer servers that feature an onboard OCP 3.0 slot for the next generation of PCIe 4.0 add on cards. Advantages of this new type include: Easier Serviceability: simply slot in / pull out the card without needing to open the server chassis; tool less design Larger Thermal Envelope: more space for heat sink provides an increased power budget for new & emerging capabilities Hardware Security Hardware-level Root of Trust Protection is built in the silicon to ensure systems will not be vulnerable to security attacks or cyber threats. This hardware-level root of trust (ROT) helps isolate the system as the boot process starts to make sure a verified code is used. Optional TPM 2.0 Module For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface (SPI) or low pin count (LPC) interface. CMC for Chassis Management & Multi-Node Monitoring GIGABYTE’s H-Series Servers feature a Chassis Management Controller (CMC) for chassis-level management and node-level monitoring by connecting nodes internally via BMC chips integrated on each node. Resulting in only one mLAN connection required to perform monitoring of all four nodes, and results in less Top-of-Rack (ToR) cabling and switch connections. Multi-Server Management GIGABYTE’s H-Series Servers also feature the ability to create a “ring” connection for monitoring & management of all servers in a rack for greater cost savings and management efficiency. Power Efficiency Automatic Fan Speed Control GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers. Cold Redundancy To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, and results of 10% improvement in efficiency. High Availability Smart Crises Management and Protection (SCMP) SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss. Dual ROM Architecture If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version. Value-added Manag
Produktspezifikation
AttributbezeichnungAttributwert
ProzessorfamilieAMD
Eingebauter Ethernet-AnschlussJa
ProzessorherstellerAMD
Anzahl der unterstützten Speicherlaufwerke24
Ethernet Schnittstellen TypGigabit Ethernet
GehäusetypRack (2U)
USB 3.2 Gen 1 (3.1 Gen 1) Anzahl der Anschlüsse vom Typ A8
Eingebauter ProzessorNein
Warentarifnummer (HS)84714100
Relative Luftfeuchtigkeit in Betrieb8 - 80 %
Ethernet LAN Datentransferraten1000 Mbit/s
LED-AnzeigenPower,Status
Unterstützte ArbeitsspeicherDDR4-SDRAM
ProzessorsockelSocket SP3
Betriebstemperatur10 - 35 °C
Kompatible ProzessorenAMD EPYC
HDD Laufwerkschächte Hot-SwapJa
Anzahl unterstützter Prozessoren4
Anzahl der 2,5" Erweiterungseinschübe24
Temperaturbereich bei Lagerung-40 - 60 °C
Anzahl Ethernet-LAN-Anschlüsse (RJ-45)8
Breite440 mm
unterstützte Speicherlaufwerksgrößen2.5 Zoll
KühlungAktiv
Zahl der DIMM Slots32
AblageschienenJa
Anzahl VGA (D-Sub) Anschlüsse4
SpeicherkanäleOkta-Kanal
Unterstützte RDIMM Taktraten3200 MHz
ProduktfarbeBlack,Steel
Lüfterdurchmesser80 mm
Maximaler RDIMM Speicher128 GB
Luftfeuchtigkeit bei Lagerung20 - 95 %
On-Board GrafikadaptermodellAspeed AST2500
Unterstützung für redundantes NetzteilJa
LAN-ControllerIntel® I350-AM2
Trusted Platform Module (TPM)Ja
80 Plus Zertifizierung80 PLUS Platinum
Tiefe695 mm
Verpackungstiefe700 mm
Anzahl der installierten redundanten Netzteile2
Anzahl der M.2 (M)-Steckplätze8
PCI-Express x16 (Gen 3.x)-Anschlüsse4
PCI-Express-Slots-Version3.0,4.0
Anzahl Lüfter8 Lüfter
Anzahl der unterstützten redundanten Stromversorgungen2
Höhe87.5 mm
Heizbecken enthaltenJa
Verpackungsbreite1167 mm
Verpackungshöhe309 mm
Verpackungsinhalt1 x H252-Z10
4 x CPU heatsinks
1 x Rail Kit